In this module you will watch a lecture video by Principal Engineer, Dr. Mitul Modi from Intel as he discusses semiconductor package manufacturing. He will explain how semiconductor packaging is a complex process and discuss the three primary phases: sort, assembly, and final test.

In this module, Dr. Mitul Modi discusses process flows for different types of semiconductor packages. He will explain how most process flows consist of three basic steps: sort, assembly, and final test. You will learn the details of how these steps vary depending on the package type. Mitul will give examples of process flows for BGA, LGA, 3D stacked LGA, and Stacked Hybrid packages. He will also mention that there are many more possible scenarios for process flows in semiconductor packaging.

In this module, Dr. Mitul Modi discusses the assembly process of semiconductor packaging and their purposes. He explains how the die is prepared, attached to a substrate, and the importance of the epoxy process. He also discusses other assembly techniques for each of these steps.

In this module, Dr. Mitul Modi discusses the different types of assembly steps in semiconductor packaging and their purposes. You will learn about the optional steps of IHS attach and ball attach, and how they improve the performance and reliability of the packages.

In this module, Dr. Mitul Modi discusses the test and final stages of semiconductor packaging and their importance. He also describes how sort, burn-in, test and finish operations ensure the quality, functionality and reliability of the packages before they are delivered to the customer.

In this module, Dr. Mitul Modi discusses the role and benefits of Process Control Systems (PCS) in semiconductor manufacturing. He will explain how PCS can detect and correct process problems that cause variation and quality issues. He will also define the concepts of targets, variation, common and special causes, control limits, and stability. Finally, he will demonstrate how to use control charts to monitor the process performance and to decide when to take action to improve the process.

In conclusion of Introduction to Semiconductor Packaging, we would like to summarize the main takeaways. We started by sharing various aspects of nanoelectronics, transistor action, reliability, and customer ease of use. Then, we explored how Moore’s Law and market use conditions affect the packages' reliability needs and the materials/design choices. At the end, we saw how the common footprint of a motherboard or socket determines a package's substrate level interconnect. Thank you for joining us.