Advanced Semiconductor Packaging
Completed by Zezhou Liu
March 9, 2024
6 hours (approximately)
Zezhou Liu's account is verified. Coursera certifies their successful completion of Advanced Semiconductor Packaging
What you will learn
Introduction to Pathway for Assembly and Packaging technologies
The evolution and impact of packaging on product performance and innovation.
Skills you will gain
- Category: Manufacturing Processes
- Category: Technical Standard
- Category: Interoperability
- Category: Thermal Management
- Category: Electronics
- Category: Semiconductors
- Category: Hardware Architecture
- Category: Systems Integration
- Category: Technology Roadmaps
- Category: Scalability
- Category: Electronic Hardware
- Category: Electronics Engineering
