Advanced Semiconductor Packaging
Completed by Michael James Langdon
January 17, 2024
6 hours (approximately)
Michael James Langdon's account is verified. Coursera certifies their successful completion of Advanced Semiconductor Packaging
What you will learn
Introduction to Pathway for Assembly and Packaging technologies
The evolution and impact of packaging on product performance and innovation.
Skills you will gain
- Category: Technical Standard
- Category: Interoperability
- Category: Thermal Management
- Category: Systems Integration
- Category: Electronics
- Category: Electronic Hardware
- Category: Scalability
- Category: Manufacturing Processes
- Category: Hardware Architecture
- Category: Semiconductors
- Category: Technology Roadmaps
- Category: Electronics Engineering
