Throughout this course, you will be introduced to Pathway for Assembly and Packaging technologies for 7-nanometer silicon feature sizes and beyond. The course will present the evolution and impact of packaging on product performance and innovation. Specifically, we highlight how packaging has enabled better products via the use of heterogeneous integration by improving the interconnects for thermal management and signal integrity.
RK
Very well deliverd and extremely pleased with the contents
BE
This course provides a great overview and Roadmap for Heterogeneous Integration and Advanced packaging. A great starting point for anyone who wants to explore the world of HI.
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As a pioneer in the industry, Intel should share more detailed materials or case studies, especially considering the advancements and maturity of packaging, assembly, and testing since Moore's era.
This course provides a great overview and Roadmap for Heterogeneous Integration and Advanced packaging. A great starting point for anyone who wants to explore the world of HI.
Complete course for IC Packaging topics
Good and Informative Course!
Excellent Course!
very good
excelent
Good.
good
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Very well deliverd and extremely pleased with the contents
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I hope this class can provide more detailed introduction of advanced packaging techniques, such CoWoS, EMIB, CPO....
Should be more detailed oriented. Target public seems to be marketing