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  • Integrated Circuit Packaging Materials

Results for "integrated circuit packaging materials"


  • Status: Free Trial
    Free Trial
    A

    Arizona State University

    Optical and X-Ray Characterization

    Skills you'll gain: Semiconductors, Analytical Testing, Laboratory Equipment, Materials science, Laboratory Testing, Analytical Chemistry, Laboratory Techniques

    4.8
    Rating, 4.8 out of 5 stars
    ·
    30 reviews

    Intermediate · Course · 1 - 3 Months

  • Status: New
    New
    P

    Packt

    Mastering Hardware Protocols with ESP32 and Arduinos

    Skills you'll gain: Network Protocols, Communication Systems, Test Equipment, Internet Of Things, Wireless Networks, Integrated Development Environments, Computer Programming Tools, Program Development

    Intermediate · Course · 1 - 3 Months

  • U

    University of California San Diego

    Internet of Things: Setting Up Your DragonBoardâ„¢ Development Platform

    Skills you'll gain: Android Development, Application Development, Android (Operating System), Android Studio, Mobile Development, Software Development Tools, Game Design, Computer Programming Tools, Development Environment, Internet Of Things, Embedded Software, Web Servers, Web Applications, USB, Ubuntu, Peripheral Devices, Operating Systems, Software Installation, Command-Line Interface

    4.2
    Rating, 4.2 out of 5 stars
    ·
    160 reviews

    Mixed · Course · 1 - 3 Months

  • Status: Preview
    Preview
    G

    Georgia Institute of Technology

    Mechanics of Materials I: Fundamentals of Stress & Strain and Axial Loading

    Skills you'll gain: Structural Analysis, Mechanical Engineering, Failure Analysis, Engineering Analysis, Mechanics, Materials science, Engineering Calculations, Civil Engineering, Mathematical Modeling, Trigonometry

    4.8
    Rating, 4.8 out of 5 stars
    ·
    3.5K reviews

    Mixed · Course · 1 - 3 Months

  • P

    Politecnico di Milano

    FPGA computing systems: Partial Dynamic Reconfiguration

    Skills you'll gain: Application Specific Integrated Circuits, Computer Architecture, Microarchitecture, Hardware Architecture, Cloud Infrastructure, Systems Design, Technical Design, Embedded Systems, System Design and Implementation, Software Design, Cloud Computing

    4
    Rating, 4 out of 5 stars
    ·
    9 reviews

    Beginner · Course · 1 - 4 Weeks

  • Status: Free Trial
    Free Trial
    A

    Arizona State University

    Electrical Characterization: MOSFETs

    Skills you'll gain: Semiconductors, Electronic Components, Laboratory Research, Electrical Engineering, Electronics Engineering, Electronics, Data Analysis Software

    4.5
    Rating, 4.5 out of 5 stars
    ·
    19 reviews

    Intermediate · Course · 1 - 3 Months

  • Status: Preview
    Preview
    G

    Georgia Institute of Technology

    Mechanics of Materials III: Beam Bending

    Skills you'll gain: Structural Engineering, Structural Analysis, Mechanical Engineering, Engineering Design Process, Engineering Analysis, Engineering Calculations, Mechanics, Schematic Diagrams, Mathematical Modeling

    4.8
    Rating, 4.8 out of 5 stars
    ·
    954 reviews

    Intermediate · Course · 1 - 3 Months

  • Status: Free Trial
    Free Trial
    U

    University of Colorado Boulder

    Integrated and Strategic Communication Campaigns

    Skills you'll gain: Strategic Communication, Target Audience, Public Relations, Marketing Communications, Advertising Campaigns, Media Strategy, Communication Strategies, Campaign Management, Integrated Marketing Communications, Branding, Earned Media, Brand Management, Paid media, Owned Media, Business Strategy, Shared Media, Employee Engagement

    4.5
    Rating, 4.5 out of 5 stars
    ·
    47 reviews

    Beginner · Course · 1 - 4 Weeks

  • Status: Free Trial
    Free Trial
    U

    University of Colorado Boulder

    Equivalent Circuit Cell Model Simulation

    Skills you'll gain: Simulations, Matlab, Mathematical Modeling, Electronic Systems, Power Electronics, Electrical Engineering, Electrical Systems, Predictive Modeling, Engineering Calculations, Engineering Analysis, Applied Mathematics, Basic Electrical Systems, Analytical Testing, Scripting, Numerical Analysis, Scripting Languages, Laboratory Testing

    4.7
    Rating, 4.7 out of 5 stars
    ·
    551 reviews

    Intermediate · Course · 1 - 3 Months

  • Status: Preview
    Preview
    U

    University of Leeds

    Working with Integrated Development Environments

    Skills you'll gain: Integrated Development Environments, Debugging, Microsoft Visual Studio, Unit Testing, Software Development Tools, Computer Programming Tools, Development Environment, Version Control

    Beginner · Course · 1 - 4 Weeks

  • Status: Free Trial
    Free Trial
    P

    Parsons School of Design, The New School

    Building Materials and Human Health

    Skills you'll gain: Environment Health And Safety, Health Disparities, Sustainable Architecture, Building Design, Sustainable Design, Hazard Analysis, Chemical and Biomedical Engineering, Environmental Science, Environmental Issue, Sustainability Standards, Social Justice, Product Lifecycle Management

    4.8
    Rating, 4.8 out of 5 stars
    ·
    37 reviews

    Intermediate · Course · 1 - 4 Weeks

  • Status: Free Trial
    Free Trial
    R

    Rice University

    Physics of Light and Materials

    Skills you'll gain: Physics, Materials science, Physical Science, Trigonometry, Mathematical Modeling, Advanced Mathematics, Linear Algebra, Differential Equations, Applied Mathematics, Problem Solving

    4.9
    Rating, 4.9 out of 5 stars
    ·
    7 reviews

    Intermediate · Course · 1 - 4 Weeks

1…8910…170

In summary, here are 10 of our most popular integrated circuit packaging materials courses

  • Optical and X-Ray Characterization: Arizona State University
  • Mastering Hardware Protocols with ESP32 and Arduinos: Packt
  • Internet of Things: Setting Up Your DragonBoardâ„¢ Development Platform: University of California San Diego
  • Mechanics of Materials I: Fundamentals of Stress & Strain and Axial Loading: Georgia Institute of Technology
  • FPGA computing systems: Partial Dynamic Reconfiguration: Politecnico di Milano
  • Electrical Characterization: MOSFETs: Arizona State University
  • Mechanics of Materials III: Beam Bending: Georgia Institute of Technology
  • Integrated and Strategic Communication Campaigns: University of Colorado Boulder
  • Equivalent Circuit Cell Model Simulation: University of Colorado Boulder
  • Working with Integrated Development Environments: University of Leeds

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