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  • Semiconductor Packaging Assembly Process


Results for "semiconductor+packaging+assembly+process"


  • U

    University of California San Diego

    Internet of Things: Sensing and Actuation From Devices

    Skills you'll gain: Internet Of Things, Embedded Software, Embedded Systems, Digital Signal Processing, Peripheral Devices, Wireless Networks, Communication Systems, Prototyping

    4.5
    Rating, 4.5 out of 5 stars
    ·
    159 reviews

    Mixed · Course · 1 - 3 Months

  • Status: Preview
    Preview
    U

    University of Illinois Urbana-Champaign

    VLSI CAD Part I: Logic

    Skills you'll gain: Computational Logic, Application Specific Integrated Circuits, Theoretical Computer Science, Data Structures, Verification And Validation, Computer Architecture, Systems Design, Algorithms, Computer Engineering, Mathematical Software, Design Software, Computer Programming Tools, Debugging, Digital Design, Software Development Tools

    4.6
    Rating, 4.6 out of 5 stars
    ·
    557 reviews

    Intermediate · Course · 1 - 3 Months

  • Status: Free Trial
    Free Trial
    A

    Arizona State University

    Selective Laser Sintering and Metal Laser Powder Bed Fusion

    Skills you'll gain: Manufacturing Processes, Equipment Design, Manufacturing and Production, Systems Of Measurement, Process Analysis, Process Control, Materials science, Laboratory Testing, Safety Training

    4.9
    Rating, 4.9 out of 5 stars
    ·
    24 reviews

    Intermediate · Course · 1 - 4 Weeks

  • Status: Free Trial
    Free Trial
    L

    L&T EduTech

    CPS solution for Industries

    Skills you'll gain: Embedded Systems, Control Systems, Programmable Logic Controllers, Robotics, Internet Of Things, C (Programming Language), Automation, Cybersecurity, Simulation and Simulation Software, Integration Testing, Cloud Computing, Matlab

    Intermediate · Course · 1 - 4 Weeks

1…6789

In summary, here are 4 of our most popular semiconductor+packaging+assembly+process courses

  • Internet of Things: Sensing and Actuation From Devices: University of California San Diego
  • VLSI CAD Part I: Logic: University of Illinois Urbana-Champaign
  • Selective Laser Sintering and Metal Laser Powder Bed Fusion: Arizona State University
  • CPS solution for Industries: L&T EduTech

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