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  • Semiconductor Packaging Assembly Process

Results for "semiconductor+packaging+assembly+process"


  • A

    Arizona State University

    Selective Laser Sintering and Metal Laser Powder Bed Fusion

    Skills you'll gain: Manufacturing Processes, Process Validation, Production Process, Manufacturing and Production, Laboratory Equipment, Systems Of Measurement, Process Analysis, Process Control, Machine Controls, Materials science, Laboratory Testing

    ★ 4.9 (24) · Intermediate · Course · 1 - 4 Weeks

    Status: Free Trial
    Free Trial
    Category: Credit offered
    Credit offered
  • P

    Packt

    Advanced Tinkercad 3D Design and Printing Techniques

    Skills you'll gain: Prototyping, 3D Modeling, 3D Assets, Design Strategies, Computer-Aided Design, Manufacturing Processes, Technical Design, Design Software, Functional Design, Manufacturing and Production, Design, Materials science, Typography, Data Import/Export, Digital Design

    Advanced · Course · 3 - 6 Months

    Category: Credit offered
    Credit offered
  • D

    Dassault Systèmes

    Practice CATIA Assembly Design

    Skills you'll gain: Assembly Drawing, Computer Aided Three-Dimensional Interactive Application (CATIA), Computer-Aided Design, Mechanical Design, Technical Design, Engineering Analysis

    Beginner · Course · 1 - 4 Weeks

    Status: Free Trial
    Free Trial
    Category: Credit offered
    Credit offered
  • A

    Arizona State University

    Material Jetting and Stereolithography

    Skills you'll gain: Manufacturing Processes, Materials science, Manufacturing and Production, Process Engineering, Production Process, Machine Controls, Experimentation, Prototyping, Process Development, System Configuration, Laboratory Testing, Analytical Testing

    ★ 4.8 (27) · Intermediate · Course · 1 - 4 Weeks

    Status: Free Trial
    Free Trial
    Category: Credit offered
    Credit offered
1…6789

In summary, here are 4 of our most popular semiconductor+packaging+assembly+process courses

  • Selective Laser Sintering and Metal Laser Powder Bed Fusion: Arizona State University
  • Advanced Tinkercad 3D Design and Printing Techniques: Packt
  • Practice CATIA Assembly Design: Dassault Systèmes
  • Material Jetting and Stereolithography: Arizona State University

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