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  • Semiconductor Packaging Assembly Process

Results for "semiconductor+packaging+assembly+process"


  • S

    Siemens

    Intro to Siemens NX: Engineering Essentials and Part Design

    Skills you'll gain: 3D Modeling, Computer-Aided Design, Drafting and Engineering Design, 3D Assets, Mechanical Design, Simulation and Simulation Software, Design Software, Engineering Software, Manufacturing Processes, Engineering Analysis

    ★ 4.4 (73) · Beginner · Course · 1 - 4 Weeks

    Category: Preview
    Preview
    Category: Credit offered
    Credit offered
  • I

    Indian Institute of Science

    Micro Electromechanical Systems

    Skills you'll gain: Semiconductors, Electronics, Electronic Hardware, Biomedical Technology, Hardware Design, Materials science, Mechanical Design, Manufacturing Processes, Communication Systems, Laboratory Equipment, Process Engineering, Laboratory Testing, 3D Modeling, Analytical Testing

    ★ 4.9 (21) · Beginner · Course · 1 - 3 Months

    Category: Preview
    Preview
    Category: Credit offered
    Credit offered
  • U

    University of Minnesota

    Introduction to Semiconductor and MEMS Fabrication

    Skills you'll gain: Semiconductors, Finite Element Methods, Medical Devices, Microarchitecture, Engineering Analysis, Process Flow Diagrams, Materials science, Laboratory Equipment, Electronics, Quality Assurance, Medical Equipment and Technology, Process Control, Biomedical Engineering, Product Testing, Mechanical Design, Manufacturing Processes, Electrical Engineering, Electronic Components, Computer Architecture, Mechanical Engineering

    ★ 4.9 (11) · Intermediate · Specialization · 3 - 6 Months

    Status: Free Trial
    Free Trial
    Category: Credit offered
    Credit offered
  • C

    Coursera

    Modern Embedded Software Engineering Architecture Toolchains

    Skills you'll gain: Real-Time Operating Systems, Embedded Software, Embedded Systems, System Software, Software Architecture, Computer Engineering, Hardware Architecture, Systems Architecture, Build Tools, Dependency Analysis, Cross Platform Development, Linux, Software Design Patterns, C++ (Programming Language)

    Intermediate · Course · 1 - 4 Weeks

    Category: New
    New
    Category: Preview
    Preview
    Category: Credit offered
    Credit offered
  • A

    Arizona State University

    Advanced Semiconductor Packaging

    Skills you'll gain: Semiconductors, Electronics Engineering, Electronics, Electronic Hardware, Hardware Architecture, Thermal Management, Scalability, Interoperability, Systems Integration, Technology Roadmaps, Manufacturing Processes, Technical Standard

    ★ 4.7 (87) · Beginner · Course · 1 - 3 Months

    Status: Free Trial
    Free Trial
    Category: Credit offered
    Credit offered
  • C

    Coursera

    Introduction to Chip Design with Open-Source EDA Tools

    Skills you'll gain: Hardware Design, Electronics Engineering, Engineering Design Process, Electronic Hardware, Electronics, Design, Computer-Aided Design, Electrical and Computer Engineering, Functional Design, Electronic Components, Verification And Validation, Simulation and Simulation Software, Design Software, Open Source Technology, Simulations, Schematic Diagrams

    ★ 4.9 (7) · Beginner · Course · 1 - 4 Weeks

    Category: Preview
    Preview
    Category: Credit offered
    Credit offered
  • C

    Coursera

    Manufacturing Industry 101

    Skills you'll gain: Manufacturing and Production, Manufacturing Operations, Production Process, Manufacturing Processes, Process Control, Production Planning, Lean Manufacturing, Production Management, Lean Methodologies, Operational Efficiency, Continuous Improvement Process, Sustainable Business, Collaboration, Innovation, Adaptability, Communication

    ★ 4.5 (21) · Intermediate · Course · 1 - 4 Weeks

    Category: Preview
    Preview
    Category: Credit offered
    Credit offered
  • A

    Arizona State University

    Introduction to Semiconductor Packaging

    Skills you'll gain: Semiconductors, Electronics Engineering, Electronics, Hardware Design, Reliability, Electronic Components, Electronic Systems, Computer Hardware, Thermal Management, Engineering, Technical Design, Mechanical Design, Systems Integration, Mechanical Engineering, Technology Roadmaps, Electrical Systems, Manufacturing Processes

    ★ 4.7 (155) · Mixed · Course · 1 - 3 Months

    Status: Free Trial
    Free Trial
    Category: Credit offered
    Credit offered
  • U

    University of Colorado Boulder

    Introduction to Embedded Systems Software and Development Environments

    Skills you'll gain: Software Configuration Management, Embedded Software, Embedded Systems, Configuration Management, Git (Version Control System), Version Control, Memory Management, Build Tools, Software Development Tools, C (Programming Language), Development Environment, Program Development, Code Review, Software Technical Review, Software Design, Make.com

    ★ 4.5 (651) · Intermediate · Course · 1 - 4 Weeks

    Category: Credit offered
    Credit offered
  • A

    Arizona State University

    Fundamentals of Semiconductor Characterization

    Skills you'll gain: Semiconductors, Electronic Components, Materials science, Electrical Engineering, Electronics, Electronics Engineering, Estimation, Engineering Calculations

    ★ 4.9 (58) · Intermediate · Course · 1 - 4 Weeks

    Status: Free Trial
    Free Trial
    Category: Credit offered
    Credit offered
  • S

    Siemens

    Expedite – Skills for Industry: Design and Manufacturing

    Skills you'll gain: Product Lifecycle Management, Conceptual Design, Sustainable Design, Project Risk Management, Project Planning, Sustainable Engineering, Product Development, Product Management, Product Design, Manufacturing and Production, Design and Product, Risk Management, Design Software, Engineering, Time Management, Internet Of Things, Cross-Functional Collaboration, Artificial Intelligence and Machine Learning (AI/ML), Artificial Intelligence, Communication

    ★ 4.8 (6) · Beginner · Course · 1 - 3 Months

    Status: Free Trial
    Free Trial
    Category: Credit offered
    Credit offered
  • S

    Siemens

    Introduction to Solid Edge

    Skills you'll gain: Computer-Aided Design, Drafting and Engineering Design, Design Software, Data Import/Export, Engineering Drawings, Assembly Drawing, Mechanical Drawings, Technical Drawing, 3D Modeling, 3D Assets

    ★ 4.7 (79) · Beginner · Course · 1 - 3 Months

    Category: Preview
    Preview
    Category: Credit offered
    Credit offered
1234…9

In summary, here are 10 of our most popular semiconductor+packaging+assembly+process courses

  • Intro to Siemens NX: Engineering Essentials and Part Design: Siemens
  • Micro Electromechanical Systems: Indian Institute of Science
  • Introduction to Semiconductor and MEMS Fabrication: University of Minnesota
  • Modern Embedded Software Engineering Architecture Toolchains: Coursera
  • Advanced Semiconductor Packaging: Arizona State University
  • Introduction to Chip Design with Open-Source EDA Tools: Coursera
  • Manufacturing Industry 101: Coursera
  • Introduction to Semiconductor Packaging: Arizona State University
  • Introduction to Embedded Systems Software and Development Environments: University of Colorado Boulder
  • Fundamentals of Semiconductor Characterization: Arizona State University

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