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  • Semiconductor Packaging Assembly Process

Results for "semiconductor packaging assembly process"


  • H

    Hebrew University of Jerusalem

    Build a Modern Computer from First Principles: From Nand to Tetris (Project-Centered Course)

    Skills you'll gain: Computer Architecture, Hardware Architecture, Computer Hardware, Computer Engineering, Computer Science, Computer Systems, Microarchitecture, Computational Logic, System Programming, Computer Programming, System Design and Implementation, Technical Design, Memory Management, Program Development, Verification And Validation

    ★ 4.9 (3.7K) · Mixed · Course · 1 - 3 Months

    Category: Preview
    Preview
    Category: Credit offered
    Credit offered
  • U

    University of Minnesota

    Introduction to Micro Electro Mechanical Systems (MEMS)

    Skills you'll gain: Medical Devices, Semiconductors, Medical Equipment and Technology, Biomedical Engineering, Electronics, Mechanical Design, Manufacturing Processes, Design Specifications, Microarchitecture, Mechanical Engineering, Materials science, Hardware Architecture, Mathematical Modeling

    ★ 4.9 (7) · Intermediate · Course · 1 - 4 Weeks

    Status: Free Trial
    Free Trial
    Category: Credit offered
    Credit offered
  • A

    Arizona State University

    Electrical Characterization: Diodes

    Skills you'll gain: Semiconductors, Electronic Components, Electronics, Production Process, Basic Electrical Systems, Test Equipment, Electrical Engineering, Manufacturing Processes, Process Control, Laboratory Equipment, Materials science, Systems Of Measurement, Engineering Calculations

    ★ 4.9 (28) · Intermediate · Course · 1 - 3 Months

    Status: Free Trial
    Free Trial
    Category: Credit offered
    Credit offered
  • U

    University of Colorado Boulder

    Diode - pn Junction and Metal Semiconductor Contact

    Skills you'll gain: Semiconductors, Electrical Engineering, Electronic Systems, Electronic Components, Electrical and Computer Engineering, Electronics Engineering, Electronics, Materials science, Mathematical Modeling, Applied Mathematics

    ★ 4.5 (295) · Advanced · Course · 1 - 4 Weeks

    Status: Free Trial
    Free Trial
    Category: Build toward a degree
    Build toward a degree
  • A

    Arizona State University

    Optical and X-Ray Characterization

    Skills you'll gain: Semiconductors, Engineering, Scientific, and Technical Instruments, Analytical Testing, Laboratory Equipment, Materials science, Laboratory Testing, Analytical Chemistry, Structural Analysis, Laboratory Techniques

    ★ 4.8 (32) · Intermediate · Course · 1 - 3 Months

    Status: Free Trial
    Free Trial
    Category: Credit offered
    Credit offered
  • A

    Arizona State University

    Engineering and Product Design Processes

    Skills you'll gain: Engineering Design Process, Engineering Drawings, Prototyping, Assembly Drawing, Product Design, Product Development, Hardware Design

    ★ 4.6 (90) · Beginner · Course · 1 - 4 Weeks

    Status: Free Trial
    Free Trial
    Category: Credit offered
    Credit offered
  • U

    University of Minnesota

    Additional Process Techniques in Microfabrication

    Skills you'll gain: Laboratory Equipment, Quality Assurance, Semiconductors, Manufacturing Processes, Materials science, Test Equipment, Electronics Engineering, Process Engineering, Process Control, Analytical Testing, Product Testing, Chemistry, Mechanical Engineering, Process Flow Diagrams, Physical Science

    Intermediate · Course · 1 - 4 Weeks

    Status: Free Trial
    Free Trial
    Category: Credit offered
    Credit offered
  • L

    L&T EduTech

    CPS solution for Industries

    Skills you'll gain: Embedded Systems, Embedded Software, Automation Engineering, Machine Controls, Control Systems, Robotics, Cyber Engineering, Internet Of Things, C (Programming Language), Automation, Engineering, Scientific, and Technical Instruments, Simulation and Simulation Software, Systems Integration, Cloud Computing, Integrated Development Environments, Electronic Components, Computer Hardware, Matlab

    Intermediate · Course · 1 - 4 Weeks

    Status: Free Trial
    Free Trial
    Category: Credit offered
    Credit offered
  • S

    Starweaver

    Business Process Modelling

    Skills you'll gain: Business Workflow Analysis, Process Modeling, Workflow Management, Process Improvement, Business Systems Analysis, Diagram Design, Project Scoping, Data Flow Diagrams (DFDs), Process Management, Business Process Management, Business Analysis, Service Design, System Design and Implementation, Business Management, Dataflow, Stakeholder Engagement, Stakeholder Communications

    ★ 4.7 (122) · Beginner · Course · 1 - 4 Weeks

    Category: Preview
    Preview
    Category: Credit offered
    Credit offered
  • P

    Packt

    Advanced 3D Printing with Fusion 360: Design Your Phone Case

    Skills you'll gain: 3D Assets, Visualization (Computer Graphics), Technical Design, Design Software, Functional Design, Usability

    Intermediate · Course · 1 - 3 Months

    Category: Credit offered
    Credit offered
  • A

    Arizona State University

    Introduction to Additive Manufacturing Processes

    Skills you'll gain: Manufacturing Processes, Schematic Diagrams, Process Flow Diagrams, Computer-Aided Design, Production Process

    ★ 4.7 (117) · Beginner · Course · 1 - 3 Months

    Status: Free Trial
    Free Trial
    Category: Credit offered
    Credit offered
  • P

    Packt

    Learn the Art and Science of PCB Design with Eagle

    Skills you'll gain: Hardware Design, Schematic Diagrams, Electronics, Software Installation, Electronics Engineering, Electronic Components, Electrical Engineering, Design Software, Technical Design, Computer-Aided Design, Manufacturing and Production, System Configuration, Data Import/Export

    ★ 3.7 (6) · Beginner · Course · 3 - 6 Months

    Category: Credit offered
    Credit offered
1…567…481

In summary, here are 10 of our most popular semiconductor packaging assembly process courses

  • Build a Modern Computer from First Principles: From Nand to Tetris (Project-Centered Course): Hebrew University of Jerusalem
  • Introduction to Micro Electro Mechanical Systems (MEMS): University of Minnesota
  • Electrical Characterization: Diodes: Arizona State University
  • Diode - pn Junction and Metal Semiconductor Contact: University of Colorado Boulder
  • Optical and X-Ray Characterization: Arizona State University
  • Engineering and Product Design Processes: Arizona State University
  • Additional Process Techniques in Microfabrication: University of Minnesota
  • CPS solution for Industries: L&T EduTech
  • Business Process Modelling: Starweaver
  • Advanced 3D Printing with Fusion 360: Design Your Phone Case: Packt

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